Hubei Nuojin Sen Technology Co.,Ltd
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Black color thermal curable solder mask for pcb industry use
| Items | Technical features | Notes |
| Color | Green , Blue | |
| Fineness | ≤8µm | 0 ~25µm Fineness gauge |
| Viscosity (25℃) | 110±20dPa﹒s | VT-04F |
| Density (25℃) | 1.20 ~1.40 g/ml | |
| Screen mesh | 90 ~120T | |
| Film thickness | 12 ~16µm | |
| Curing energy | 1000 ~1800 mJ/cm2 | The effective value through the polyester film |
| Pencil hardness | ≥4H | Pencil hardness test |
| Adhesion | 100/100 | Laceration experiment |
| Insulation resistance | ≥1.0×108Ω | IPC-SM-840D 3.8.2 |
| Resistance to molten Tin |
260±5℃×10secends×3times OK |
IPC-SM-840D 3.7.2 |
| Environment standard | In compliance with RoHS directives | SGS testing |
| Flammability | UL94V-0 | Certified number:UL-E189612 |
| Package | 5.0kg/bucket , 20kg/box | |
| Shelf time | 6 months since the date of manufacture | Store below 25℃ in dark |
It is a solder mask printed by mesh and then heat-curing. After membranization, the coating is resistant to the damage from solder and chemical, print the single side or two sides of the circuit board while local solder. In order to give full play to its advantage, the detailed operation as below:
1. Making the mesh, use the mesh of 18T~36T and the squeegee of 65°— 70°.
2. Stir the gel equally. The viscosity of the gel is about 600-900ps. If you need to dilute the gel, please choose thinner special for the gel developed by us.
3. When printing, please try best to make the coating thicker to 400um or more.
4. Curing condition, two side circuit board, 150°C*3-5 minutes for the first side printing, and 150°C*18-30minutes for the second side printing.
5. Before tin solder, please check the coating with air bubble or not, please check the circuit board about leak printing. The tin stove is 260-3000°C,immerse soldering time is 3 seconds, air knife is 350-1000°C,the pressure of the air knife is 4.0-5.0kg.
6. Protect the gold fingers and gold plating position, after printing, the coating must be thicker than 350um.
7. Curing condition: 150°C*15-25minutes
Note:the thicker coating printing, the longer curing time, the better thermostability. If the coating is pull-out or melted during the soldering, please extend the curing time to 5-10 minutes. Used in protect gold finger when PCB spray-tin through the tin stove well as ware-soldering. The information above is just for reference, the actual operation depend on the environmental condition and different operating methods. The detailed operation, please contact the supplier.
Attention:
1.The base and hardner should be mixed according to the ratio and stired throughly before using.
2.We will offer you special diluent or DPM if the ink need dilute.
3.The values above are based on experients in our lab.Experients need to be carried out in order to get proper using condition.
