Hubei Nuojin Sen Technology Co.,Ltd

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Liquid Photosensitive Solder Mask Etch Resist Red Solder Mask

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Hubei Nuojin Sen Technology Co.,Ltd
City:wuhan
Province/State:hubei
Country/Region:china
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Liquid Photosensitive Solder Mask Etch Resist Red Solder Mask

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Place of Origin :China
Brand Name :NUOJINSEN
Certification :ROHS,SGS
Model Number :1605
MOQ :100kgs
Price :Negotiation
Packaging Details :1kg,5kg,10kg,20kg
Delivery Time :7-10days
Payment Terms :T/T,LC
Supply Ability :100000kgs/month
Color :Red
Fineness :≤8µm
Mix ratio :Base/Hardener=3:1
Solid content after mixing :75±3%
Viscosity after mixing (25℃) :200±30 dPa﹒s
Density after mixing (25℃) :1.30 ~1.50 g/ml
Pot life after mixing :24 hour
Environment standard :In compliance with RoHS directives
Halogen content :≤600ppm
Pre-baking limit :75℃ , 70 min
Exposure energy :300 ~600 mJ/cm2
Shelf life :6 months since the date of manufacture
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Liquid photo image pcb ink ,red color,plastic packing for export

Items Technical features Notes
Color Red
Viscosity (25℃) 10±2dPa﹒s VT-04F
Fineness ≤5µm 0 ~25µm Fineness gauge
Solid content 50±5%
Density (25℃) 1.10 ~1.20 g/ml
Resolution 50µm (2.0mil)
Adhesion 100/100 Laceration experiment
Plating resistance Copper ,Tin ,Nickle and Aurum Normal plating technics
Hardness ≥2H Pencil harder
Etching Acidic/Alkaline etching solution
Pre-baking limit 75℃, 60min
Package 5.0kg/bucket , 20kg/box According to customer requirements
Shelf time 6 months since the date of manufacture Store below 25℃ in dark

Working procedure

1. Mixing

Mixing a small amount main agent with hardener and stirring thoroughly,then mixing the mixture above with the remanent main agent,add appropriate diluent and stirring 5-10 minutes. The viscosity of ink is adjusted to 120 PS if printed by hand. And it is adjusted to 180 PS if printed by machine.It is adjusted to 200 PS if it is aluminum tamponade .The viscosity of ink mixed above is measured at 25 degrees. Please use the special diluent of our company if the viscosity of ink needs to adjust.

  • Remain time

10-15 minutes after stiring uniformly

  • Ordinary boards:43T;Chemical-plating Aurum or Tin boards:36T
  • Pre-baking

1) Single side printing separately

First side:72-76 degrees,15-18 min

Second side:72-76 degrees,30-35 min

  • Double sides printing simultaneously:72-76 degrees,40-60min
  • Exposure

300-500mJ/cm2,Black ink:600-750mJ/cm2,exposure step:10-12 steps

  • Developing:

Developing solution:0.8-1.2wt% Na2CO3 or K2CO3 aqueous solution

Developing solution temperature:28-32 degrees

Spray pressure:1.5-2.5kg/cm2

Developing time:40-90 seconds

  • Post cure

Spray Tin board:150 degrees*(60-120min)

Chemical-plating Aurum board:150 degrees*(50-60min)

Thick copper plate,boards printed with black ink should be post-black in subsection:75 degrees*(60-120min)+100 degrees*30 min+150 degrees*(60-90min)

  • Safe time

6 months since the date of manufacture,store below 25 degree in dark

  • Attention:

1) Mixing the ink fully before using

2) We will offer you special diluent or PMA if the ink need dilute

3) The values above are based on experiments in our lab.Experiments need to be carried out in order to get proper using condition.

Liquid Photosensitive Solder Mask Etch Resist Red Solder Mask

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